Industry body ISIG charts roadmap to strengthen India's semiconductor packaging sector

The Indian Semiconductor Industry Group (ISIG) is convening semiconductor executives, institutional investors and government officials to chart a strategic course for developing India's advanced packaging and power electronics capabilities. The collaborative effort reflects growing momentum to build domestic expertise in semiconductor manufacturing segments that remain predominantly concentrated outside the country. Advanced chip packaging and power electronics represent key value-addition opportunities within the broader semiconductor supply chain, with significant implications for India's self-reliance in electronics manufacturing. The initiative seeks to identify infrastructure gaps, skill requirements and policy levers necessary to establish competitive manufacturing ecosystems in these segments. Industry analysts have noted that India's participation in advanced semiconductor packaging could strengthen its position in the global electronics value chain while creating high-skilled employment opportunities across the country. The engagement of government stakeholders alongside private sector representatives suggests an alignment of vision around leveraging India's demographic advantages and manufacturing ambitions in semiconductor-related industries.