World · Singapore Bureau
Samsung, SK Hynix boost China chip manufacturing capacity with advanced technology
South Korea's two largest memory chipmakers are upgrading their Chinese production facilities to manufacture next-generation flash memory chips. The facilities will produce NAND memory with more than 200 layers, marking a significant advancement in chip density and performance.
LSN Singapore ·
Samsung Electronics and SK Hynix are investing in their China-based manufacturing plants to produce more sophisticated memory components, according to industry sources. The upgrades will enable production of multi-layered NAND flash memory chips that exceed 200 layers, enhancing storage capacity and speed for consumer and industrial applications.
The move underscores the continued importance of China's manufacturing base for semiconductor production, despite rising geopolitical tensions between Beijing and Seoul. Both companies operate substantial production facilities in China and have maintained operations there even as other chipmakers reassess their regional strategies.
Advances in NAND flash technology, particularly increases in layer count, allow manufacturers to store more data in the same physical space while improving performance metrics. The 200-plus layer threshold represents a competitive benchmark in the industry, with leading producers continuously pushing technological boundaries to meet growing global demand for memory chips.
The upgrades come as global demand for semiconductor memory remains robust across data centers, smartphones, and consumer electronics. Both Samsung and SK Hynix are among the world's largest memory chip suppliers and continue to invest in manufacturing capacity to maintain their market positions.